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TTTC's Electronic Broadcasting Service

IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
(DFT 2018)
October 8-10, 2018
Chicago, IL, USA

http://www.dfts.org/

SUBMISSION DEADLINE EXTENDED TO MAY 18, 2018
CALL FOR PAPERS

Scope

DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in VLSI and nanotechnology systems inclusive of emerging technologies. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation are of interest.

The topics include (but are not limited to) the following ones:

1. YIELD ANALYSIS AND MODELING: Defect/fault analysis and models; statistical yield modeling; diagnosis; critical area and other metrics.

2. TESTING TECHNIQUES: Built-in self-test; delay fault modeling and diagnosis;  testing for analog and mixed circuits; online testing; signal and clock integrity.

3. DESIGN FOR TESTABILITY IN IC DESIGN: FPGA, SoC, NoC, ASIC, low power design and microprocessors.

4. ERROR DETECTION, CORRECTION, AND RECOVERY: Self-testing and self-checking solutions; error-control coding; fault masking and avoidance; recovery schemes, space/time redundancy; hw/sw techniques; architectural-specific techniques, system-level design-time or runtime strategies.

5. DEPENDABILITY ANALYSIS AND VALIDATION: Fault injection techniques and frameworks; dependability and characterization.

6. REPAIR, RESTRUCTURING AND RECONFIGURATION: Repairable logic; reconfigurable circuit design; DFT for on-line operation; self-healing; reliable FPGA-based systems.

7. DEFECT AND FAULT TOLERANCE: Reliable circuit/system synthesis; radiation hardened and/or tolerant processes and design; design space exploration for dependable systems, transient/soft faults and errors.

8. AGING AND LIFETIME RELIABILITY: Aging characterization and modeling; design and run-time reliability, thermal, and variability management and recovery.

9. DEPENDABLE APPLICATIONS AND CASE STUDIES: Methodologies and case study applications to Internet of Things, automotive, railway, avionics and space, autonomous systems, industrial control, etc.

10.EMERGING TECHNOLOGIES: Techniques for 2.5D/3D ICs, quantum computing architectures, memristors, spintronics, microfluidics, etc.

11.DESIGN FOR SECURITY: Fault attacks, fault tolerance-based countermeasures, scan-based attacks and counter-measures, hardware trojans, security vs. reliability trade-offs, interaction between VLSI test, trust, and reliability.

Submissions

Prospective authors are invited to submit original and unpublished contributions. Two types of submissions are possible: (i) regular papers (6 pages), and (ii) short papers (4 pages). Both types will be included in the symposium proceedings and should adhere to the IEEE conference template, 2-columns style (available on conference web site), and submitted as a PDF file, electronically. Please refer to the symposium web page for updated information.

Proposals for Special Sessions are also invited. For more information, visit symposium website and see the specific call.

Key Dates

Abstract submission deadline:       May 4, 2018

Full paper submission deadline:  May 18, 2018

Acceptance notification:               July  6, 2018

Camera ready deadline:              July 27, 2018

Additional Information

Paper Publication: Proceedings will be published by the IEEE Computer Society and will appear in the Digital Library. All papers will be considered for the DFT 2018 Best Paper Award. Furthermore, selected papers will be considered for a special issue/section of an archival journal.

Venue: The symposium is going back to North America on its 31st edition and will take place in the USA at the Wyndam Grant Hotel, Chicago Waterfront, on the south end of the Magnificent mile, on Chicago river. The Chicago metropolitan area has nearly 10 million people and is the third-largest in the United States. Chicago has often been called a global architecture capital and is considered one of the most important business centers in the world.

Committee

Organizing Committee

General co-chairs:

 Program co-chairs:

 Publicity chair:

Publication chair:

Industrial liaison chair:

 Program Committee

  • L. Anghel, TIMA, FR
  • G. Beltrame, École Polytechnique de Montréal, CA
  • C. Bolchini, Politecnico di Milano, IT
  • L. Cassano, Politecnico di Milano, IT
  • G. Chapman, Simon Fraser University, US
  • J. Dworak, Southern Methodist University, US
  • M. Ebrahimi, KTH Royal Inst. Technology, SE
  • S. Eggersgluess, University of Bremen, DE
  • O. Ergin, TOBB University, TR
  • A. Evans, CEA-LETI DACLE, MINATEC, FR
  • G. Furano, ESA, NL
  • D. Gizopoulos, University of Athens, GR
  • J. Han, University of Alberta, CA
  • S. Hari, nVidia, US
  • P. Harrod, ARM, UK
  • L. Hernandez, Liverpool University, UK
  • C. Huang, National Tsing Hua University, TW
  • H. Ichihara, Hiroshima City University, JP
  • V. Izosimov, KTH Royal Inst. Technology, SE
  • X. Jan, Virginia Tech, US
  • P. Joshi, Cadence, US
  • A. Kanuparthi, Intel Corporation, US
  • N. Karimi, University of Maryland, US
  • R. Karri, NYU Polytechnic, US
  • Mehran Kermani, USF, US
  • S. Khursheed, Liverpool University, UK
  • Y. Kim, Northeastern University, US
  • I. Koren, Univ. of Massachusetts-Amherst, US
  • B. Kruseman, NXP, NL
  • S. Kundu, Univ. of Massachusetts-Amherst, US
  • H. Li, Chinese Academy of Science, CN
  • F. Lombardi, Northeastern University, US
  • J. Mathew, IIT Patna, IN
  • S. Menon, Intel Corporation, US
  • C. Metra, University of Bologna, IT
  • M. Michael, University of Cyprus, CY
  • A. Miele, Politecnico di Milano, IT
  • K. Namba, Chiba University, JP
  • N. Nicolici, McMaster University, CA
  • C. Nicopoulos, University of Cyprus, CY
  • M. Ottavi, Univ. of Rome “Tor Vergata”, IT
  • I. Polian, University of Passau, DE
  • I. Pomeranz, Purdue University, US
  • S. Pontarelli, Univ. of Rome “Tor Vergata”, IT
  • M. Psarakis, University of Piraeus, GR
  • A. Rahmani, Univ. of California Irvine, US
  • P. Rech, UFRGS, BR
  • S. Reddy, University of Iowa, US
  • P. Reviriego, Universidad Nebrija, ES
  • D. Rossi, University of Hertfordshire, UK
  • C. Sandionigi, CEA, FR
  • Mario Schölzel Univ. of Potsdam Germany
  • M. Shafique, Technische Universität Wien, AT
  • R. Shafik, New Castle University, UK
  • T. Siddiqua, AMD, US
  • I. Sourdis, Chalmers Univ. of Technology, SE
  • V. Sridharan, AMD, US
  • M. Taouil, TU Delft, NL
  • J.P. Teixeira, IST/INESC-ID, PT
  • N. Touba, University of Texas at Austin, US
  • S. Tragoudas, S. Illinois Univ Carbondale, US
  • B. Venu, ARM, UK
  • G. Yalcin, Abdullah Gul University, TR
  • T. Yoneda, National Institute of Informatics, JP
  • Q. Yu, University of New Hampshire
For more information, visit us on the web at: http://www.dfts.org/

The CONFERENCE is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


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